Lead and expand Arm's North American university research partnerships by identifying academic contributions to technology roadmaps, coordinating multi-party collaborations, engaging US government funding opportunities, ensuring agreements and tracking, and acting as Arm's primary academic contact while aligning with internal stakeholders like Government Affairs and Workforce Development.

Lead end-to-end execution of complex multi-die SoC programs, coordinating Die and Functional TPMs, managing schedule, risks, tapeout readiness, cross-die integration, metrics, governance reviews, and program budgets to ensure on-time, on-quality delivery.

Lead cross-functional engineering teams to plan, schedule, track, and deliver System IP and SoC-related products (CPU, GPU, MMU, GIC, PHY, interconnect). Manage resources, budgets, risks, changes, and dependencies; communicate with product and technical leads; ensure on-spec, high-quality, and timely delivery across the hardware/Soft IP development lifecycle.