Teams at Broadcom

Design complex flip-chip BGA packages for high-performance ASICs used in AI, networking, HPC, and 5G applications. Responsibilities include package layout, signal and power integrity, thermal performance, reliability, manufacturability, project scheduling, customer interface, and collaboration with internal and vendor teams. The role also supports process improvement, documentation, automation, and multi-project execution.

Lead the architecture, deployment, and scaling of agentic AI infrastructure for embedded memory design, characterization, DFT, silicon bring-up, and yield optimization. Develop multi-agent LLM workflows, integrate AI systems with EDA tools and enterprise data, automate scan-failure analysis, build predictive yield models, and establish evaluation, testing, and safety guardrails. Collaborate with memory designers, DFT experts, EDA specialists, and infrastructure engineers to deliver production-grade AI engineering solutions.

Develops and deploys Calibre verification decks for advanced FINFET, GAA, and high-voltage technologies. Defines tool acceptance criteria, creates IP test cases and test structures, automates CAD workflows, supports extraction and simulation tools, resolves EDA and technology-file issues, documents processes, trains design engineers, and evaluates emerging EDA capabilities. The role collaborates with foundries, EDA vendors, and internal engineering teams to support physical verification and post-layout extraction.