Teams at Broadcom

Designs complex flip-chip BGA packages for high-performance ASICs used in AI, networking, HPC, and 5G applications. Responsibilities include package layout, signal and power integrity, thermal and reliability considerations, manufacturability, and design of SerDes, ADC/DAC, DDR, and related structures. The engineer manages multiple projects, collaborates with global teams and vendors, interfaces with customers, and improves design processes through automation and documentation. This is a fully onsite role.

Develop competitive intelligence and product marketing programs for enterprise cybersecurity solutions. Create battlecards, compete kits, positioning guides, and market intelligence updates; train sales teams and partners on competitive positioning; and provide customized competitive guidance for strategic deals. Collaborate cross-functionally with product management, sales, engineering, and marketing teams while using AI productivity tools to streamline research and insight distribution.

Design and architect high-speed 100G+ SerDes signal-processing systems, including equalizers, FEC, filters, modulation, and analog compensation. Develop MATLAB and C/C++ models, simulations, requirements, verification plans, firmware, and lab tests. Collaborate with analog, digital, RTL, firmware, and validation teams to implement and debug ASIC designs. Support communications standards development, customer meetings, technical documentation, and marketing collateral.