K2 Space Corporation Benefits Overview

Design and develop high-performance RF and millimeter-wave MMICs, including power amplifiers, low-noise amplifiers, and RF switches, from architecture through tapeout, characterization, and product integration. Perform circuit and electromagnetic simulations, optimize performance, develop test plans, validate hardware, correlate measurements with simulations, and collaborate with systems, antenna, packaging, and transceiver teams on satellite communication products.

Designs advanced ASIC packages, including FC-BGA and MCM architectures, from early trade studies through production. Responsibilities include substrate and ball-map definition, SI/PI and thermal design, high-speed signal breakout, material and assembly selection, vendor management, qualification, and collaboration with silicon, RF, and systems teams. The role focuses on high-pin-count, power-dense mixed-signal and digital SoC packages for high-reliability aerospace applications.

Lead end-to-end ASIC package architecture and execution for high-performance FC-BGA and MCM solutions. Own substrate stackups, ball maps, SI/PI, thermal design, material selection, vendor qualification, packaging standards, and production ramp. Partner with silicon, RF, and systems teams to optimize package interfaces and ensure reliable, first-pass success for high-pin-count, power-dense mixed-signal and digital ASICs.