Jobs at K2 Space Corporation

Lead ASIC package architecture and detailed FC-BGA/MCM package designs for high-pin-count, high-speed, power-dense SoCs. Drive package trade studies (SI/PI, thermal, manufacturability, reliability), define standards, collaborate with silicon/RF/systems teams, work with OSATs and substrate vendors, and support qualification and production ramp.

Lead end-to-end RTL-to-GDSII physical design for high-performance SoCs in advanced FinFET nodes. Own synthesis, floorplanning, P&R, CTS, STA, DRC/LVS and sign-off; develop methodologies and automation to optimize PPA; drive timing closure, coordinate package/SI/PI and DFT, manage external PD partners and EDA tool flows, and support post-silicon bring-up and production for spaceflight-qualified designs.

Lead full physical design flow for complex SoC blocks and top-level integration from synthesis to GDSII. Drive timing closure, PPA optimization, physical sign-off (DRC/LVS, IR drop, EM), ECOs and tapeout. Collaborate with front-end, verification, DFT, packaging teams and external vendors, develop automation and methodology, and support products through production and spaceflight.

The role involves leading ASIC package design for FC-BGA and MCM solutions, ensuring high-performance mixed-signal/digital SoCs succeed from architecture to production. Responsibilities include trade studies, design standards, and vendor collaboration.

Lead verification of custom ASIC/SoC from block to full-chip: develop verification plans, build SystemVerilog/UVM testbenches, run constrained-random and directed tests, use SVA and formal methods, manage regressions and CI, drive coverage closure, support post-silicon bring-up, and influence DV methodology across cross-functional teams.

Define and execute verification plans for block-to-full-chip ASICs using SystemVerilog/UVM. Build testbenches, assertions, constrained-random and directed tests, manage regressions and CI, run simulations, triage failures, close coverage, and support silicon bring-up and post-silicon debug while collaborating across architecture, RTL, DFT, firmware, and physical design teams.

Lead DFT architecture and implementation for complex mixed-signal SoCs. Responsible for RTL-level scan and BIST insertion, ATPG flow development and coverage closure, mixed-signal test strategies, DFT verification and signoff, silicon bring-up support, and methodology/automation improvements while collaborating with design, verification, and physical design teams.

Lead development of behavioral models and mixed-signal verification methodology for analog/mixed-signal SoCs. Create Verilog/SystemVerilog/Verilog-AMS models, build co-simulation testbenches, integrate AMS into UVM digital environments, support architectural exploration, and drive cross-functional alignment with RF, analog, and digital teams to ensure successful silicon tapeout and bring-up.

Develop and execute verification plans for block, subsystem, and full-chip designs. Build SystemVerilog/UVM testbenches, write SVA, apply constrained-random and directed tests, run simulations, triage failures, drive root-cause analysis, maintain coverage and regression suites, and collaborate with cross-functional teams through sign-off.

The Principal GNC Engineer will drive spacecraft GNC architecture, perform verification and validation, develop tools and algorithms, and support launch operations, while mentoring engineers.

Develop and enhance embedded firmware for high-performance mixed-signal and digital SoCs, contributing to firmware architecture and supporting hardware bring-up and validation.