Jobs at Marvell Technology

The engineer will develop advanced microelectronic packages, focusing on electrical design, modeling, and characterization for high-speed interfaces, collaborating with various teams to ensure manufacturability and compliance.

Lead physical design teams for high-performance SoCs, oversee RTL-to-GDSII implementation, mentor engineers, and develop advanced methodologies.

The role involves defining verification strategies for complex SoCs, implementing UVM-based environments, and ensuring full coverage and functional correctness through collaboration with diverse engineering teams.

The role involves driving micro-architecture and RTL implementation for SoCs in AI, cloud computing, and 5G networks, collaborating with teams on design, verification, and integration, and improving productivity in digital IC design. Candidates must have extensive experience in digital IC design, synthesis, and verification.

The role involves drafting, reviewing, and managing commercial agreements, supporting legal teams, and utilizing technology for contract administration and reporting.

Develop and maintain CAD flows, support modular CAD integration, drive architectural decisions, and innovate for design challenges with a focus on collaboration and communication.

Lead implementation of DFT/Test for complex ASIC/SoC and chiplet designs using Tessent and related EDA tools. Define DFT architecture, run insertion flows, generate patterns, support STA constraints, and drive post-silicon bring-up and debug. Mentor a small DFT team and enhance methodologies and tools across multi-die custom compute designs.

Lead the development of advanced packaging technology for HPC and AI solutions, focusing on architecture, integrity studies, and collaboration with external partners.

The role involves managing and improving engineering compute infrastructure, focusing on job management, storage systems, and reliability within high-throughput environments.

The Senior Staff Engineer designs and maintains scalable build flows for digital IC designs, improving performance and developer productivity, and collaborates with multiple teams to enhance quality and efficiency.

Lead packaging technology roadmap for advanced computing systems, focusing on architecture, design validation, and material selection in collaboration with cross-functional teams.

The role involves developing advanced packaging technologies, defining architectures, leading co-design efforts, and ensuring product manufacturability and reliability for high-performance computing and AI solutions.

The role involves architecting and implementing high-speed analog and mixed-signal circuits for photonic transceivers and electronic ICs, requiring collaboration with multidisciplinary teams.