Teams at Nokia

Leads optoelectronic assembly process development and transfer to manufacturing for optical engines. Manages engineering teams, process design, equipment, qualification efforts, vendors, budgets, schedules, risks, and product road maps. Requires hands-on expertise in optoelectronic or microelectronic assembly, automated equipment, DOE, FMEA, statistical analysis, and cross-functional technical leadership.

Lead PIC production test capacity, infrastructure, and ramp activities while managing test engineers and technicians. Responsibilities include hiring, onboarding, mentoring, resource prioritization, cross-functional collaboration with wafer fabs and operations, and development of production test hardware, software, and procedures. The role also oversees testability requirements, new product introduction testing, efficiency improvements, and engineering changes for photonic integrated circuit products.

Leads production ramp-up projects across multiple manufacturing sites, managing project plans, capital expenditures, equipment delivery and integration, timelines, risks, records, and cross-functional coordination. Facilitates status meetings, reports performance to senior leadership, and supports continuous improvement and best-practice adoption. The role partners with engineering, procurement, operations, and site leadership to expand manufacturing capacity for optical communication systems.