Advanced Package Technology Principal Engineer

About Marvell

Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, automotive, and carrier architectures, our innovative technology is enabling new possibilities. 

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. 

Your Team, Your Impact

The Marvell Advanced Packaging R&D team is responsible for package design and technology development to meet the electrical, mechanical, thermal and system requirements for the next generation high performance computing (HPC), Artificial Intelligence (AI) and networking solutions. The group focuses on signal integrity, power integrity, thermal integrity, mechanical integrity, processability, manufacturability, and reliability, involving high speed signaling and complex power delivery networks (PDNs) requiring innovative and custom solutions to meet constantly evolving customer needs. Many of the new designs require multi-chip, multiple component configurations involving, but not limited to, 2.5D and 3D packages, Co-packaged copper or optics and advanced substrates. Marvell has partnered with the world's leading manufacturers to solve our customer’s most challenging designs and integrations with industry-leading packaging technologies.

What You Can Expect

• Work with stakeholders to define and validate advanced design rule roadmap for interposer, substrates and packages.

• Work with vendors to define and validate equipment, process and material roadmap.

• Explore technologies beyond what is currently available, make recommendations, and create and protect IP to maximize performance. 

• Explore technology feasibility and create proof-of-concept samples.

• Collaborate with IP, Si design, package design, production and test teams.

What We're Looking For

• Experience in advanced package and substrate technologies with deep understanding of process and materials, component and board level reliability, warpage and thermal management.

• Experience in managing substrate and assembly material vendors, substrate manufacturers, OSATs and foundries.

• Bachelor’s degree in Mechanical Engineering, Material Science, Electrical Engineering or related fields and 10-15 years of related professional experience. OR Master’s degree and/or PhD in Electrical Engineering,echanical Engineering, Material Science, or related fields with 5-10 years of experience.

Skills needed to be successful in this role:  

• Deep understanding of advanced 2.5D/3D package technology including (a) CoWoS-S/R/L, (b) EMIB, (c) CPO, (d) CPC.

• Strong understanding of chip-package interactions and failure mechanism at component and board level, thermal and warpage management.

• Ability to manage programs involving cross-functional teams. Strong interpersonal skills and willingness to learn new things are necessary along with the ability to work with stakeholders in multiple time zones across the globe.  

• Ability to influence suppliers to align their roadmap with company goals.

• Strong communication, presentation and documentation skills

The ideal candidate would have: 

• Understanding of component (substrate, interposer, etc.) and package designs.

• Knowledge of signal integrity and power integrity.

• Board and system level integration.

• Experience with silicon disaggregation and reaggregation and memory integration.

Expected Base Pay Range (USD)

148,500 - 219,780, $ per annum

The successful candidate’s starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions.

Additional Compensation and Benefit Elements 

At Marvell, we offer a total compensation package with a base, bonus and equity.Health and financial wellbeing are part of the package. That means flexible time off, 401k, plus a year-end shutdown, floating holidays, paid time off to volunteer. Have a question about our benefits packages - health or financial? Ask your recruiter during the interview process.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.

Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at [email protected].

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