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Nokia

(Career Fair) Process Integration Engineer

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Hiring Remotely in United States
Junior
In-Office or Remote
Hiring Remotely in United States
Junior

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Troubleshoot and improve InP-based photonic integrated circuit wafer fabrication by performing failure analysis, SPC monitoring, data collection/analysis using MES, coordinating lot movement, establishing process specifications, and supporting process and operations engineers to drive yield, reliability, throughput, and next-generation platform ramps.
The summary above was generated by AI

In the position of Process Integration Engineer, you will ensure high quality and reliability of InP-based Photonic Integrated Circuit (PIC) products through extensive experiments and data analysis.  You will have the opportunity to help bring up our new high-volume fab in San Jose, CA. You will work with various functional teams to troubleshoot and improve wafer fabrication processes and drive improvements in yield reliability 

Responsibilities

Your Key Responsibilities:

  • Troubleshoot challenging performance and yield issues in the wafer fab

    • Investigate the reason and root cause for lots being put on hold

    • Provide support for engineers with failure analysis – visual inspections, CD-SEM work, electrical IV sweeps, profilometer depth measurements, etc.

    • Use Manufacturing Engineering System (MES) software to help with integration engineering activities – collect data, perform basic data analysis, generate Power Point reports, etc.

    • Routine review of SPC charts and initial response for out-of-control events

    • Coordinate and follow movement of qual and development lots through fab, assembly, and test areas

    • Manage quality and yield of PIC wafers based on knowledge of fab processes, device physics, and the analysis of test and reliability data

    • Troubleshoot and resolve process deviations and test failures through a detailed analysis of test data and process history

    • Establish and maintain inline FAB process specifications.

    • Support Process Engineering to improve process stability and capability

    • Support Operations to improve throughput and cycle time

    • Support next-generation PIC platform development and participate in technology development, transfer, and ramp activities to meet yield, reliability and device performance goals

    • Help to assure compliance with PIC product quality system

Qualifications

Minimum Knowledge/Skills/Abilities:

  • At least 2 years of experience working in a modern semiconductor fab which places a high premium on quality.

    • Understanding of semiconductor processes and device physics

    • Understanding of statistical process control methods

    • Familiarity with or direct experience in most of the standard semiconductor process technologies required for wafer fabrication such as epitaxy, wet etching, plasma etching, metal deposition, and photolithography

    • Strong focus on quality and attention to detail

    • Eager to learn and expand skill set

    • Strong follow-up skills and problem-solving ability and drive

    • Takes ownership for tasks and projects

    • Team-player with good communication skills, verbal and written

    • Ability to organize data and keep track of several simultaneous projects and deadlines

Education Required: 

  • B.S. or higher in Electrical Engineering, Photonics, Physics, or Materials Science with at least 2 years of semiconductor fab experience.

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