New College Grad - Memory Design Engineer, HBM

As a Memory Design Engineer at Micron Technology, Inc., you will be responsible for designing and analyzing digital and analog circuits used in the development of memory products. We are engaged in developing groundbreaking silicon-to-systems solutions – right from technology development and advanced memory designs to product development, systems design and validation resulting in premier memory solutions.

In this position, you will collaborate with Micron’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction.

The Memory Design Engineer is responsible for designing, simulating, and optimizing DRAM circuits while supporting the development of digital and analog circuitry used in advanced memory products. This role collaborates globally across design, verification, product engineering, test, probe, process integration, assembly, and marketing to ensure manufacturable, high‑quality, cost‑optimized solutions. The position drives innovation in future memory generations and supplies to silicon‑to‑system development in a dynamic engineering environment.

Responsibilities

• Design digital, analog, and memory core circuits using CMOS logic and transistors, implementing device specifications from concept to solution.

• Create optimized floorplans for circuit placement, routing, power delivery, sense margins, array timing, and die size, including layout leadership.

• Conduct circuit simulations using FINESIM, HSPICE, and VERILOG; analyze power, performance, reliability, and parasitic impacts.

• Validate builds through reticle experiments, tape‑out revisions, and simulation‑to‑silicon correlation, identifying required schematic edits.

• Prepare and maintain design documentation while giving to best‑known practices and departmental training.

• Collaborate with global build, verification, product engineering, test, probe, process integration, assembly, and marketing teams to ensure manufacturability and quality.

• Lead layout and develop resources, track project tasks, and serve as the point of contact for design, layout, verification, and test issues.

• Prepare project status reports and lead design reviews to communicate progress and technical decisions.

Minimum Qualifications

• BS or MS in Electrical Engineering or related field

• Coursework in CMOS Circuit Design, VLSI, and Analog Circuit Design, with understanding of device reliability and circuit floor planning.

• Strong analytical and problem‑solving skills with validated significant technical contributions and a record of innovation.

• Ability to proactively collaborate across multiple engineering organizations to optimize manufacturing quality, cost, reliability, and time‑to‑market.

Preferred Qualifications

• Expertise in DRAM subsystem architecture, specification, operation, or design.

• Self‑motivated with strong problem‑solving abilities and an aim to discover new solutions.

• Deep knowledge of industry‑specific technologies and competitive trends.

• Excellent communication and interpersonal skills for multi-functional collaboration