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Nokia

RF Systems & Integration Researcher

Posted Yesterday
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In-Office or Remote
2 Locations
Senior level
In-Office or Remote
2 Locations
Senior level
The RF Systems & Integration Researcher will conduct research on RFIC interconnects and mm-Wave technologies, involving design, simulation, testing, and collaboration with teams.
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At Nokia Bell Labs, we are looking for a highly skilled and motivated individual to join our EM Systems & Integration Department. The RF Systems & Integration Researcher will play a vital role in defining and implementing novel architectures for RFIC interconnect, packages, and modules. This role offers an exciting opportunity to work directly with other Bell Labs researchers and Nokia business units, contributing to cutting-edge research and development in the field of mm-Wave technology.

Responsibilities
  • Perform leading research and system analysis on RFIC interconnect, packages, and modules for mm-Wave applications.
  • Design, simulate, and characterize state-of-the-art RFIC packages and interconnect, applying expertise in 3D EM component design and simulation software.
  • Conduct hands-on testing and measurements of mm-Wave components, ensuring a deep understanding of mm-Wave technology and high-speed measurement techniques.
  • Identify key areas and applications within the mm-Wave spectrum, driving innovation and exploring emerging technologies.
  • Collaborate effectively with a larger team, demonstrating strong interpersonal skills and the ability to work well with other research groups within Nokia Bell Labs.
Qualifications
  • Ph.D. in Electrical Engineering or Physics with a minimum of 4 years of industry experience, or MSEE with 8 years of experience.
  • Expertise in 3D EM component design, including interconnect, with proficiency in simulation software such as 3DS CST or ANSYS HFSS.
  • Hands-on experience in RF circuit design (Up-converter, PLL+VCO, DC/DC regulator) and simulation software (Keysight ADS or Cadence AWR).
  • Knowledge of IC packaging materials, substrate design, and microelectronics assembly process flows.
  • Familiarity with PCB technology, including schematic capture and layout design tools (Altium Designer, Cadence Allegro, Siemens Xpedition).
  • Advanced knowledge of RF test equipment and component characterization, with strong technical writing skills for publication.
  • Excellent interpersonal skills and the ability to collaborate effectively within a team environment.
  • Nice to have: Experience with SI & PI simulation and analysis, phased arrays, RF filters, and programming languages like MATLAB or Python.

Top Skills

3D Em Component Design
3Ds Cst
Altium Designer
Ansys Hfss
Cadence Allegro
Cadence Awr
Keysight Ads
Matlab
Mm-Wave Technology
Python
Siemens Xpedition
Simulation Software

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