Principal Process Integration Engineer

The Principal Process Integration Engineer is responsible for ensuring the quality, reliability, and yield of InP-based Photonic Integrated Circuit (PIC) products. This role plays a key part in ramping high-volume production and works cross-functionally to troubleshoot and optimize wafer fabrication processes, resolve yield issues, and support next-generation PIC platform development.

· Own wafer quality and yield using deep knowledge of fab processes, device physics, and test/reliability data

· Analyze process deviations and test failures to identify root causes and implement corrective actions

· Establish, maintain, and monitor inline fab process specifications and capability (CPK)

· Drive yield improvement initiatives from concept through qualification and production release

· Define design rules and develop test structures for effective process control

· Support technology development, transfer, and manufacturing ramp for next-generation PIC platforms

· Partner with Process Engineering to improve process stability and capability

· Collaborate with Operations to improve throughput and reduce cycle time

· MS or Ph.D. in Electrical Engineering, Materials Science, Physics, Chemical Engineering, or a related field

· 10+ years of experience in semiconductor wafer fabrication

· Hands-on experience with III-V processes, including epitaxy, wet and dry etching, photolithography, and metal deposition

· Strong understanding of semiconductor processes and device physics

· Proven analytical and problem-solving skills with proficiency in data analysis tools (e.g., JMP, Python)

· Experience with SPC, DOE, and yield optimization methodologies

· Excellent communication skills with the ability to present technical work to diverse stakeholders