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Top Tech Jobs & Startup Jobs in Austin, TX
3D Printing
Leads the module product engineering organization for advanced semiconductor power modules from new product introduction through high-volume production and sustaining. Responsibilities include team staffing and development, product readiness standards, manufacturability, qualification, yield and cost improvement, production governance, cross-functional execution, manufacturing-site alignment, executive escalations, customer issues, and strategic planning. Requires deep semiconductor power-module expertise, technical leadership, data-driven decision-making, and strong executive communication.
Top Skills:
Clip AttachDie AttachDigital Power VrmsHigh-Volume ManufacturingIpc-A-610Multiphase ControllersOsatPower MosfetsSemiconductor Power ModulesSmart Power StagesSolder IntegrityStatistical AnalysisVertical Power Stages
3D Printing
Owns product direction and roadmaps for Renesas.com and related global digital properties. Leads customer discovery, requirements definition, backlog prioritization, agile delivery, cross-functional collaboration, product analytics, launch optimization, and stakeholder communication. Partners with engineering, design, content, marketing, and technical teams to improve digital experiences for technical audiences. Also identifies opportunities for responsible AI, automation, semantic search, and emerging digital capabilities.
Top Skills:
Analytics ToolsAPIsArtificial IntelligenceAutomationCloud InfrastructureContent Delivery NetworksContent Management SystemsCustomer Portal TechnologiesExperimentation PlatformsIdentity TechnologiesPersonalizationSearch PlatformsSemantic SearchStructured Data
3D Printing
Develop and support digital power management solutions for data center applications. Translate customer and market needs into product requirements, collaborate with design and marketing teams, validate features using FPGA prototypes and laboratory automation, and resolve technical issues. Provide customer-facing technical marketing, training, product analysis, supplier coordination, intellectual property support, and guidance on application validation plans for multiphase power systems.
Top Skills:
AsicAutomated Lab TestingControl Loop TheoryCpuDigitally Enabled Power ManagementFpgaGpuMixed-Signal IcsMultiphase Dc/Dc ConvertersNetwork AnalyzersOscilloscopesWaveform Generators
3D Printing
Lead definition and new product introduction of next-generation multiphase AI power modules. Coordinate mechanical, software, systems, packaging, quality, product management, and manufacturing teams; align thermal and power requirements; manage engineering samples, planning gates, readiness reviews, prototyping, and production transitions. Present product proposals to senior stakeholders and provide data-driven recommendations on critical issues.
Top Skills:
Digital Power VrmsMultiphase ControllersNew Product Introduction (Npi)Power ElectronicsPower MosfetsPower TowersSemiconductor ManufacturingSmart Power StagesVertical Power Stages
3D Printing
Develop and validate digital power management solutions for data-center processors and SoCs. Define product requirements, support FPGA prototyping, resolve design tradeoffs, create validation plans, develop intellectual property, and align with ASIC suppliers. Provide technical marketing support through customer visits, competitive analysis, product planning, technical training, and customer problem solving.
Top Skills:
AsicControl Loop TheoryDigital Power ManagementFirmwareFpgaLaboratory Test AutomationMixed-Signal Integrated CircuitsMultiphase Dc/Dc ConvertersNetwork AnalyzersOscilloscopesWaveform Generators
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3D Printing
Leads engineering operations and AI transformation initiatives across web development, QA, production, and product teams. Establishes roadmaps, prioritization frameworks, reporting practices, meeting cadences, decision logs, and operating rhythms. Manages cross-functional dependencies, improves delivery visibility, coordinates stakeholders, and helps transition AI prototypes into scalable engineering workflows. Partners with technical leads and business stakeholders to strengthen execution discipline and support broader engineering operational leadership.
Top Skills:
CmsConfluenceDrupalJIRAMicrosoft 365Next.Js
3D Printing
Develops and manages automated test equipment solutions for semiconductor products from planning through production. Responsibilities include creating test programs, supporting qualification and characterization, implementing reusable hardware and software solutions, conducting reviews, coordinating production ramp, improving yield, investigating customer returns, mentoring engineers, and managing external technical partners.
Top Skills:
Advantest V93KAutomated Test Equipment (Ate)BasicC++Cohu DiamondxEts364MultimetersOscilloscopesPcb LayoutPerlPythonSpea Dot800Spectrum Analyzers
3D Printing
Define and implement mixed-signal verification strategies for digital power management products. Create system-level verification plans, establish model-to-silicon correlation, define measurable pass/fail criteria, support verification automation and data aggregation, and collaborate across analog, digital, firmware, validation, and software teams to close verification gaps and document methodology.
Top Skills:
Api-Driven WorkflowsBehavioral ModelingDashboardsDatabasesEmulationMatlabPythonReal-Number ModelingRtlSimplisSimulationSystemverilog RnmVerilog-Ams
3D Printing
Support product engineering for digital multiphase controller power products across NPI and production. Lead bring-up, characterization, yield analysis, root-cause investigations, manufacturability and quality activities. Drive cost, yield, and cycle-time improvements, support manufacturing release and PCNs, assist failure analysis and customer technical engagements, and collaborate with cross-functional teams to meet performance, cost, and schedule goals.
Top Skills:
Digital Power ControllersJmpMatlabMultiphase ControllersPower MosfetsPythonSmart Power StagesVrms
3D Printing
Develop, qualify, and industrialize semiconductor package solutions from concept to high-volume manufacturing. Lead package design, assembly process development, reliability testing, failure analysis, DOE-driven optimization, and cross-functional collaboration with silicon, manufacturing, quality, and OSAT partners to meet performance, cost, and schedule targets.
Top Skills:
2.5D/3D PackagingBall AttachDesign Of Experiments (Doe)Die AttachEncapsulation And MoldingFailure AnalysisFan-Out Packaging (Foplp/Fowlp)Flip-Chip AssemblyFlip-Chip Csp (Fccsp)Osat CollaborationPackage Reliability TestingPackage SingulationRoot-Cause AnalysisStatistical AnalysisSurface-Mount Technology (Smt)System-In-Package (Sip)UnderfillWafer BackgrindWafer DicingWafer-Level Packaging (Wlp/Wlcsp)Wire Bonding
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