Top Tech Jobs & Startup Jobs in Austin, TX

Owns the product lifecycle for digital multiphase power semiconductor products serving AI, cloud, data center, server, networking, telecom, and computing markets. Defines product strategy, roadmaps, market requirements, competitive positioning, pricing, and go-to-market materials. Leads cross-functional engineering, applications, testing, sales, and global teams through product development and launches while translating technical concepts into customer-facing documentation and presentations.

Leads cross-functional semiconductor capacity expansion and cost reduction initiatives across engineering, manufacturing, sourcing, supply chain, quality, finance, and marketing. Identifies savings opportunities, develops roadmaps, coordinates PCN and part-number changes, supports end-of-life activities, tracks savings and risks, manages suppliers and customers, escalates issues, and facilitates executive reviews. The role balances cost, quality, performance, capacity, customer commitments, and execution timelines.

Lead advanced semiconductor package architecture, design, simulation, qualification, and production integration. Responsibilities include selecting packaging technologies and OSAT partners, defining layouts and materials, analyzing thermal, mechanical, electrical, and reliability performance, developing assembly processes, resolving yield and qualification issues, and supporting high-volume manufacturing. The role also requires cross-functional technical leadership, supplier collaboration, documentation, and mentoring of junior engineers.

Provides strategic analysis, market and competitive intelligence, project coordination, executive decision support, and cross-functional communication for Renesas’ Power Product Group. The role supports long-range planning, commercial strategy, M&A, technology evaluation, operational initiatives, and executive presentations. Candidates should be strong in quantitative analysis, business problem-solving, project ownership, and executive communication, with semiconductor industry experience.

Leads package technology development, NPI, R&D, OSAT management, qualification, roadmap execution, and budget management for advanced power semiconductor packages. Directs design and development of SiP, power modules, wafer-level, flip-chip, SiC, GaN, DBC, and AMB technologies. Selects materials and manufacturing partners, optimizes processes through DOE, establishes production controls, resolves integration and quality issues, supports production ramp-up, and maintains package design rules and customer adoption programs.

Lead product engineering across full lifecycle for power semiconductors: silicon bring-up, characterization, qualification, production release, and sustaining. Drive root-cause analysis, yield and test improvements, reliability analysis, and customer issue resolution. Partner with design/test/manufacturing, analyze data to guide decisions, and mentor junior engineers.

Design, develop, and verify embedded firmware for digital PWM voltage regulators on custom SoCs. Collaborate with hardware and validation teams for silicon bring-up, write specifications, implement features and workarounds, and build automated lab tests.

Design, develop, test, and maintain customer-facing software bridging hardware, firmware, and applications. Gather cross-functional requirements, implement solutions using Java/Kotlin/Python/TypeScript/React, troubleshoot system failures, participate in code reviews, and apply DevOps and testing best practices.

Define and validate digital mixed-signal architecture for power-management SoCs: ADC interfaces/controllers, front-end DSP, telemetry, emulation models, RTL-facing specs, firmware interfaces, and validation criteria. Collaborate cross-functionally to translate requirements into executable models, optimize tradeoffs, and document interfaces and validation evidence from model to silicon.

Lead global backend engineering for HPC SoC and MCU programs from RTL to GDS, ensuring implementation, signoff, PPA targets, and on-time tape-out. Build and scale distributed teams, standardize flows and metrics, improve execution predictability, and partner with foundries, EDA vendors, and cross-functional stakeholders.