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Top Tech Jobs & Startup Jobs in Austin, TX
3D Printing
Lead design-in and customer support for Renesas DC-DC and multiphase power solutions: perform schematic and PCB reviews, simulate and debug converters, author application notes, train FAEs, support on-site/remote customer engineering, and inform product definition through system-level analysis and market research.
Top Skills:
AllegroAmd SviAvsbusCCadenceControl LoopDc-Dc Converter TopologiesDigital ControllersElectronic LoadFunction GeneratorIntel SvidLab Equipment AutomationMosfetOrcadOscilloscopePmbusPower IcPspicePythonSimplis
3D Printing
Own end-to-end product engineering for advanced power modules from NPI through high-volume production and sustaining. Drive manufacturability, assembly standards (IPC-A-610), yield analysis, qualification, product change management, and cross-functional resolution of production issues to meet performance, quality, cost, and schedule targets.
Top Skills:
Ipc-A-610Multiphase ControllersNpiOsatPcnPower MosfetsPower TowersSmart Power StagesVertical Power StagesVrm
3D Printing
Lead architecture and design of embedded firmware for UALink switch ASICs, spanning hardware-software co-design, protocol and transport implementation, link initialization and topology discovery, SDK/API exposure to BMCs (OpenBMC/Redfish), performance optimization for low-latency collective primitives, advanced RAS features, and firmware security including secure boot and runtime attestation.
Top Skills:
AsicCCryptographic Firmware AuthenticationCxlFecFreertosJtagLauterbach Trace32NvlinkOpenbmcOscilloscopePcie Gen5Pcie Gen6Pcie Protocol AnalyzerPythonRedfishRtlRuntime AttestationSecure BootSerdesThreadxUalinkZephyr
3D Printing
Lead design, production release, and continuous improvement of ATE hardware (loadboards, probe cards, sockets, change kits). Manage vendor relationships, review schematics/layout/BOMs, support first-article builds and debug, maintain inventory and coordinate shipments to meet NPI timelines.
Top Skills:
Analog InstrumentsAteAte HandlersBomChange KitsDigital InstrumentsLoadboardsNpiPcb DesignPcb LayoutProbe CardsSchematicsTest Sockets
3D Printing
Lead system-level architecture for next-generation AI scale-up network chassis: define chassis and backplane topologies, high-speed SerDes routing, multi-kilowatt power and cooling orchestration, platform management stack (BMC/OpenBMC/Redfish/MCTP/PLDM), secure boot and firmware update flows, platform security (SPDM, NIST SP 800-193), and platform-level RAS and thermal/power telemetry for hyperscale AI deployments.
Top Skills:
48V Power Delivery54V Power DeliveryAcpiBmcCxlDevice DriversIpmiLiquid CoolingMctpNist Sp 800-193NvlinkOam/UbbOcp Orv3OpenbmcOs/Vmm KernelsPcie Gen6Pcie Gen7PldmRedfishSerdesSpdmUalinkUefiUltra Ethernet
Reposted 26 Days AgoSaved
3D Printing
The role involves overseeing executive recruiting processes, managing search strategies, and collaborating with senior leaders to ensure quality hiring outcomes for G-level positions. Responsibilities include governance, process excellence, search firm management, and providing market intelligence to influence talent strategies.
3D Printing
Develop and maintain ATE test programs and hardware/software solutions for NPI, qualification, characterization, and production. Coordinate cross-functionally to enable ramps, support yield and returns, mentor junior engineers, and manage external test partners.
Top Skills:
Advantest V93KAutomated Test Systems (Ate)BasicC++Cohu DiamondxEts364MultimeterOscilloscopePcb LayoutPerlPythonSpea Dot800Spectrum Analyzer
3D Printing
Design, develop, test, and maintain customer-facing software that interfaces with IC/firmware teams. Gather requirements, troubleshoot system failures, perform code reviews, and contribute across projects using Java, Kotlin, Python, and frontend technologies.
Top Skills:
Behavior-Driven DevelopmentBus CommunicationsConfluenceGitlabJavaJavafxJavaScriptJIRAKotlinMicrocontroller ProgrammingPythonReactTypescriptUnit Testing
3D Printing
Design and deliver advanced semiconductor package solutions (FCBGA, SiP, WLCSP, power modules, chiplets). Execute package CAD layout, maintain CAD databases, generate manufacturing outputs, ensure DFM/DFAs and vendor/foundry compliance, and collaborate with SI/PI, thermal, reliability, silicon, and manufacturing teams throughout release cycles.
Top Skills:
Bump MapsCadence Allegro Package DesignerDfaDfmDrcFcbgaGerber/Drill DataLvsNetlistQfnQfpRdlSi/Pi (Signal Integrity/Power Integrity)Siemens Xpedition Substrate IntegratorSipSip LayoutWlcsp
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